LIPAC is a fabless company specializing in semiconductor design. As a company that designs optical communication and optical sensor parts, it succeeded in developing a 100GBASE-SR4 model that can be used as an optical connection module for high-speed data centers. It has secured 14 global patents for optical packaging and is attracting attention as the next generation semiconductor packaging technology. It is currently developing various types of optical engines used in inter-server interconnection applications in data centers that meet MSA standards.